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余乐 - YU Le

作者: 计算机与信息工程学院  |  发布日期:2017-03-17 16:19:03  |  阅读次数:

 

余乐,博士后,电子信息系,讲师

联系方式:yule@btbu.edu.cn

讲授课程:微电子技术基础

研究方向:智能硬件

教育背景:

2012 10-2015 04      中国科学院电子学研究所    微电子与固体电子学  博士后

2009 03-2013 01      中国科学院电子学研究所    微电子与固体电子学  工学博士

2006 09-2008 07      北航-佛罗里达国际大学      软件/电子信息工程    工程/理学双硕士

2001 09-2005 07      北京航空航天大学机械学院 材料成型及控制工程  工学学士

项目经历:

1支持卫星移动通信模式的终端基带处理芯片研发 (国家重大专项) 40nm FPGA-ip核项目

2三百万门宇航用单粒子加固FPGA器件 (中科院重点方向性项目) 130nm 百万门级FPGA项目

3片上可编程系统前沿技术研究”                    <创新团队国际合作伙伴>计划

4基于TSV互连的三维FPGA架构及关键技术       国家自然科学基金面上项目(61271149

发表论文:

[1] Le Yu, Haigang Yang, Jing, T.T., et al. Electrical Characterization of RF TSV for 3D Multi-Core and Heterogeneous ICs, Proceedings of IEEE/ACM International Conference on Computer-Aided Design, Nov. 7-11, 2010, San Jose, CA, 686-693.

[2] Le Yu, Haigang Yang, Jia Zhang, et al. Performance Evaluation of Air-gap-Based Coaxial RF TSV for 3D NoC, 19th IFIP/IEEE VLSI-SOC 2011 (HK, China), Oct. 3-5, 2011, 94-97.

[3] 余乐,杨海钢,谢元禄,三维集成电路中硅通孔缺陷建模及自测试/修复方法研究”,电子与信息学报,2012Vol. 34, No. 9, pp.2247-2253

[4] Yu Le, et al., “Air-gap-based RF coaxial TSV and its characteristic analysis”, Journal of Electronics China (JEC), 2013, Vol. 30, No.6.

[5] Yu Le, et al., “A design methodology for low-leakage and high-performance buffer based on deviant behavior of gate leakage”, JEC, 2014, Vol. 5, No. 5.

[6] Le Yu, et al., “RF-TSV Design, Modeling and Application for 3D Multi-Core Computer Systems”, JEC, 29(2012)5, 431-444.

[7] 余乐,等,“Air-gap-based RF coaxial TSV and its characteristic analysis”,中国电子学会电路与系统分会24届学术年会,2013,优秀论文.

[8] Jia Zhang, Le Yu, Haigang Yang, et al., “Self Test Method and Recovery Mechanism for High Frequency TSV Array”, 19th IFIP/IEEE VLSI-SOC 2011 (HK, China), Oct. 3-5 2011, pp.260-265.

[9] 王一,杨海钢,余乐,多层金属电源线地线网络拓扑结构的IR-drop分析方法,电子学报,2013. 

[10] 王一,杨海钢,余乐FPGA开关矩阵中基于通道结构的漏电流优化方法,电子与信息学报,2013Vol. 35No. 11, pp. 2784-2789.

[11] 张春红,杨海钢,史传进,韦援丰,余乐,一种带动态开关控制电路的开关式DC-DC转换器,微电子学,2013.

 

 

Name: YU Le

Academic Posts

Lecturer, Department of Electronic Information, School of Computer and Information Engineering.

Research interests: Dig Data Processing and Acceleration Technology.

Teaching courses Micro-Electronics Technology.

 

Professional Experiences

2015-now, Lecturer, Beijing Technology and Business University, Beijing.

2012-2015, Post Doctor, Institute of Electronics, Chinese Academy of Sciences, Bejing.

 

Education

2009-2013, Ph.D. in Micro-Electronics and Solid-States Electronics, Institute of Electronics, Chinese Academy of Sciences, Beijing.

2006-2008, Dual-Master Degrees in Electronical Engineering & Software Engineering, Beihang University(BHU) & Florida International University(FIU), Beijing.

2001-2005, Bachelor, Beihang University, Beijing.

 

Selected Publications

 

 

[1] Le Yu, Haigang Yang, Jing, T.T., et al., “Electrical Characterization of RF TSV for 3D Multi-Core and Heterogeneous ICs”, Proceedings of IEEE/ACM International Conference on Computer-Aided Design, Nov. 7-11, 2010, San Jose, CA, 686-693.

[2] Le Yu, Haigang Yang, Jia Zhang, et al., “Performance Evaluation of Air-gap-Based Coaxial RF TSV for 3D NoC”, 19th IFIP/IEEE VLSI-SOC 2011 (HK, China), Oct. 3-5, 2011, 94-97.

[3] Yu Le, Yang Hai-gang, Xie Yuan-lu, et al., “A 3D IC Self-test and Recovery Method Based on Through Silicon Via Defect Modeling”, Journal of Electronics and Information Technology, 2012, Vol. 34, No. 9, pp.2247-2253

[4] Le Yu, Haigang Yang, Yuanlu Xie, et al., “RF-TSV Design, Modeling and Application for 3D Multi-Core Computer Systems”, Journal of Electronics(China), 2012, Vol 29, No.5, 431-444.

[5] Yu Le, Sun Jiabin, Zhang Chunhong, et al., “Air-gap-based RF coaxial TSV and its characteristic analysis”, Journal of Electronics(China), 2013, Vol 30, No.6.

[6] Yu Le, Sun Jiabin, Zhang Chunhong, et al., “Air-gap-based RF coaxial TSV and its characteristic analysis”, Annual meeting of the Chinese society of electronics, circuit and Systems Society, 2013.

[7] Jia Zhang, Le Yu, Haigang Yang, et al., “Self Test Method and Recovery Mechanism for High Frequency TSV Array”, 19th IFIP/IEEE VLSI-SOC 2011 (HK, China), Oct. 3-5 2011, pp.260-265.

[8] Wang Yi, Haigang Yang, Le Yu, et al., “A Technique for IR-Drop Analysis of the Multiayered Power/Ground Networks. Chinese Journal of Electronics”, 2015, Vol.43, No.12, 2542-2546.

[9] Wang Yi, Yang Hai-gang, Yu Le, et al., “Leakage Current Optimization for FPGA Switch Matrixes Based on Routing Architecture”, J of Electr and Info Technology, Vol.35, No.11, 2784-2789.

[10] Zhang Jia, Yang Haigang, Sun Jiabin, Yu Le, et al., “Modeling of enclosed-gate layout transistors as ESD protection device based on conformal mapping method”, Journal of Semiconductors, 2014, Vol. 35, No. 8, 085001-1 - 085001-7.

 

Contact

Phone +86-10-68985506

E-mailladd_u@163.com